Researcher:
Wei Hu
Summary:
In the layup of prepreg laminates, air is inevitably entrapped between adjacent prepreg plies. However, the removal of this inter-ply air under vacuum-bag-only (VBO) cure condition is not well understood. An in-situ visualization technique was developed to dynamically observe inter-ply void evolution during VBO cure. Simulating the conditions of inter-ply air removal during cure is accomplished by incorporating a perforated resin film inter the lay-up. The goals of this present study are(1) to increase the understanding of inter-ply gas induced void formation and removal mechanisms; (2) to develop science-based void reduction strategies for VBO prepregs
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